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ASE Increases Advanced Packaging Prices by Up to 20%

AirdropBlackHole
On July 1, according to MoneyDJ, ASE, a global leader in outsourced semiconductor assembly and test (OSAT), has once again adjusted its packaging prices, with increases of over 20% in some cases. This price hike covers various advanced packaging technologies, including chip-on-wafer substrate packaging (CoWoS) and fan-out wafer-level packaging (FoCoS), affecting its major clients in the United States. ASE CEO Wu Tianyu stated that the price increase primarily reflects the rising costs of raw materials, which is necessary; additionally, it reflects increased capital expenditures, considering investment costs.
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