Samsung Electronics announces 2nm process and AI semiconductor ecosystem cooperation plan

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Odaily Planet Daily News: Samsung Electronics held the SAFE Forum 2026 in Seoul, announcing the next-generation 2nm process, DTCO design-and-technology co-optimization technology, and a high-performance SRAM roadmap, and proposing a strategy to expand Korea’s AI semiconductor ecosystem cooperation and next-generation wafer foundry outsourcing technology. Samsung Electronics said it will strengthen communication with customers and partners through the SAFE Forum, and further reinforce its platform role in Korea’s system semiconductor industry beyond wafer foundry and mass production. Korean AI fabless company Rebellions said it has developed the REBEL100 NPU based on Samsung Electronics’ 4nm foundry process and advanced packaging, and will continue to cooperate in the AI semiconductor field. Samsung Electronics also participates in the M.AX Alliance promoted by South Korea’s Ministry of Trade, Industry and Energy, advancing the development of low-power, high-performance on-device AI semiconductors for the automotive, home appliance, robotics, and defense sectors, and will continue to support the MPW project to reduce the burden of initial sample production for Korean fabless companies, as well as the K-CHIPS talent cultivation program.
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