Shenchao TechFlow news: On June 30, Amanda Ng, a portfolio specialist at Princely Group, said in a report that the next phase of AI-related investment opportunities may emerge further upstream in the supply chain, rather than among the much-hyped AI platforms or chip manufacturers. She noted that areas such as advanced packaging, semiconductor substrates, and high-end printed circuit boards (PCB) are becoming increasingly critical. Although these components account for a relatively small share of the total bill of materials required for AI, they could still become key bottlenecks. She also mentioned that even if the prices of these products rise only slightly, it can significantly boost manufacturers’ profits while remaining within a range that is affordable for end customers. (Jin Shi)