mSAP Major Divergence: The "Last Bastion" of Fine Line Circuits – Can 15 Microns Reshape the $45 Billion PCB Industry Chain?

With the AI computing architecture upgrading from CoWoS to CoWoP, the PCB industry chain is undergoing a dual leap in both technology and value. As high-speed CCL materials in the M8-M10 grade become the new battleground for industry competition, it is expected that from 2026 to 2027, AI computing power demand will continue to encroach on high-end capacity, and the sector will show a “Davis double play” trend of “a supply-demand gap, technology upgrades, and upward price movement.”

In 2026, the global mSAP PCB market is estimated to be about 8 billion yuan, and it is expected to achieve growth of more than double in 2027. The scaled ramp-up of 1.6T optical modules, the industrialization of advanced AI packaging (CoWoP), and the rigid demand from AI servers for high-density interconnects are jointly pushing the mSAP process from “high-end optional” to “the only mandatory.”