>>TSMC Teams Up with Winbond to Build a Homegrown DRAM Supply Chain for AI

• Amid deepening global memory shortages, TSMC has brought Winbond into its AI chip supply chain. The two companies will collaborate on next generation WoW (Wafer on Wafer) 3D stacking technology, with Winbond supplying DRAM wafers and TSMC stacking them with logic wafers for use in AI chips.
• TSMC has historically relied on Samsung Electronics, SK Hynix, and Micron, but as the supply shortage has intensified, it is seen as moving to diversify its sourcing. The industry views this partnership not as a simple supply agreement but as part of a TSMC strategy to cultivate a memory supply chain within Taiwan and strengthen the supply stability of its AI chips. Winbond, for its part, is expected to use this as a springboard to enter the AI server and high performance computing supply chains in earnest.