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CICC: The industrialization of diamond heat sinks will first start in high-power, high-value scenarios.

K-LinePoet
CICC research report believes that 2026 will be a critical window for industrial verification of diamond heat dissipation. AI high-power GPUs continue to drive the logic of material substitution, while domestic supply chains simultaneously accelerate equipment capacity expansion and customer sample certification. On the hardware side, NVIDIA's Rubin architecture GPU consumes up to 2300W, making traditional copper-based heat dissipation unable to match the extremely high local heat flux density. On the supply side, leading diamond companies have collectively landed large-scale CVD expansion projects, MPCVD equipment capacity continues to ramp up, and the first domestic 8-inch large-size diamond heat sink production line has been put into operation. On the application side, the core node of the Zhengzhou National Supercomputing Internet has completed large-scale deployment of diamond-copper composite modules, moving the supply chain from lab testing to batch verification. The industrialization pace of diamond heat sinks will first start with high-power, high-value scenarios, initially focusing on customer verification and pilot orders, and then expand to standardized packaging platforms and large-scale orders once the process window, yield, and certification data stabilize.
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