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The funds in tech stocks are mainly revolving around these five directions.
Memory chips, glass substrates, photoresist, power semiconductors, advanced packaging.
Memory chips:
Samsung and SK Hynix expansion expectations and CXMT IPO supply chain.
Yoke Technology, Jiangfeng Electronics, Deep Technology, Tai Chi Industry, Zhicheng Technology, North Huachuang, etc.
Glass substrates:
Still have expectations of hitting new highs.
BOE, Kaisheng Technology, Kibing Group, Delixi Laser, Wogo Optoelectronics, etc.
Photoresist:
Main logic is substitution for Japan.
Nanda Optoelectronics, Tongcheng New Materials, Dinglong Co., Ltd., Xinlai Yingcai, Feikai Materials, Jiangfeng Electronics, etc.
Power semiconductors:
Price increase expectations for silicon carbide and third-generation semiconductor concepts.
Silan Micro, Lioni Micro, Dongni, New Clean Energy, Sanan Optoelectronics, etc.
Advanced packaging:
Advanced packaging is used in glass substrates and new high-end semiconductor technologies.
JCET, Huatian Technology, Jingfang Technology, Jingce Electronics, Zhongke Feyce, etc.
Chasing highs carries risk; invest with caution.