Comprehensive Overview of Main Technology Trends for the Second Half of 2026

2026 H2 Technology Main Line Panoramic Review

Reviewing industry and post-market data up to June 26, divided into five main lines: AI computing power, semiconductor domestic substitution, advanced manufacturing, aerospace/digital economy, and new energy technology. Each track includes core logic + three leading stocks. For industry education only, not investment advice.

I. AI Computing Infrastructure (Tracks 1–6)

Track 1: High-Speed Optical Modules (800G/1.6T/CPO)

Core Logic: Overseas cloud vendors' capex is surging, 1.6T volume deliveries in H2, CPO enters mass production cycle, performance continues to materialize
Leaders: Zhongji Innolight, Eoptolink Technology, Tongfu Microelectronics

Track 2: Optical Chips/Indium Phosphide Substrates

Core Logic: Critical bottleneck for computing optical modules, accelerating domestic substitution, high-speed DFB and indium phosphide substrate capacity ramp-up
Leaders: Yuanjie Technology, Accelink Technologies, Yunnan Germanium

Track 3: AI Server Systems / Domestic Computing Chips

Core Logic: Global intelligent computing center expansion, domestic computing autonomy policy support, orders full for the year
Leaders: Inspur Information, Sugon, Hygon Information Technology

Track 4: Computing PCBs / Copper-Clad Laminates

Core Logic: Surging demand for high-frequency boards in high-end AI servers, layer count and unit price rising in tandem
Leaders: Wus Printed Circuit, Victory Giant Technology, Shengyi Technology

Track 5: Liquid Cooling & Temperature Control (Data Center Heat Dissipation)

Core Logic: High-power AI servers driving rapid penetration of liquid cooling, standard for new computing centers
Leaders: Envicool, Sugon Digital Creation, Gaolan Shares

Track 6: MLCC High-End Automotive / Computing Capacitors

Core Logic: Tight supply of high-capacity MLCC for AI servers and EVs, upward cycle, upstream powders also rising
Leaders: Fenghua Advanced Technology, Sanhuan Group, Sinocera

II. Semiconductor Domestic Substitution (Tracks 7–12)

Track 7: Memory Chips / Memory Modules

Core Logic: DRAM/NAND continues to rise in price, AI storage and automotive-grade storage demand surges, interim reports generally show high growth
Leaders: GigaDevice, Longsys, Biwin Storage

Track 8: Advanced Packaging (HBM/Chiplet)

Core Logic: Only capacity expansion path for computing chips, 2.5D/3D packaging enters large-scale commercial use
Leaders: JCET, Huatian Technology, Wuxi Taiji Industry

Track 9: Semiconductor Equipment (Etch/Thin Film/Clean)

Core Logic: Domestic fabs expanding capacity, equipment localization verification accelerating, strongest long-term growth certainty
Leaders: NAURA Technology, AMEC, Changchuan Technology

Track 10: Semiconductor Electronic Special Gases / Lithography Materials

Core Logic: Essential consumables for wafer manufacturing, continuous verification breakthroughs, downstream expansion driving consumables volume
Leaders: Yoke Technology, Xingfu Electronic, Tongcheng New Materials

Track 11: Silicon Wafers / Semiconductor Targets

Core Logic: Mature process nodes at full capacity, large silicon wafers and high-purity targets with broad import substitution potential
Leaders: NSIG, Youyan New Materials, Jiangfeng Electronics

Track 12: Third-Generation Semiconductors (GaN/SiC)

Core Logic: Essential for 6G RF, vehicle fast charging, inverters; export controls accelerating domestic progress
Leaders: Sanan Optoelectronics, Wingtech Technology, Luxia Technology

III. High-End Intelligent Manufacturing (Tracks 13–15)

Track 13: Humanoid Robots / Reducers

Core Logic: Embodied intelligence industry commercialization, domestic breakthroughs in servo and reducer core components
Leaders: Inovance Technology, Estun Automation, Shuanghuan Transmission

Track 14: Industrial Automation Servo / Controllers

Core Logic: Manufacturing equipment renewal cycle starts, factory smart retrofitting orders rebounding
Leaders: Inovance Technology, Xinje Electric, STEP Electric

Track 15: Mini/Micro LED Displays

Core Logic: AI large screens, automotive displays, VR devices releasing demand, Ledman Optoelectronic micro-display implementation
Leaders: Ledman Optoelectronic, Sanan Optoelectronics, BOE

IV. Aerospace Communication / Digital Economy (Tracks 16–18)

Track 16: Commercial Satellites / Satellite Internet

Core Logic: LEO satellite constellation accelerates, satellite manufacturing, RF, ground equipment volume increasing
Leaders: China Satellite, Haige Communication, Zhenyou Technology

Track 17: Fiber Optic Cables / Submarine Cables / Computing Communication Transmission

Core Logic: Dual demand from computing backbone and offshore wind submarine cables, overseas orders growing
Leaders: Hengtong Optic-Electric, Yangtze Optical Fibre, ZTT

Track 18: AI Large Models / Industry Applications

Core Logic: Government, enterprise, industrial, and healthcare AI implementation, business models gradually monetizing, continuous policy support
Leaders: iFlytek, 360, TRS Information Technology

V. New Energy Technology & New Materials (Tracks 19–20)

Track 19: Scarce Strategic Metals (In/Ga/Ge/Sb/Re)

Core Logic: Essential for semiconductors, military, optical communications, globally scarce reserves, export controls support prices
Leaders: Yunnan Germanium, Tin Industry Stock, Huayu Mining

Track 20: Energy Storage / Solid-State Battery Materials

Core Logic: Wind and solar base supporting storage expansion, solid-state batteries entering vehicle integration verification phase
Leaders: CATL, Tinci Materials, Pylon Technologies

Core Rhythm Summary for H2 Market

1. July–August: Interim report performance window, optical modules, memory, advanced packaging and other high pre-growth tracks dominate;
2. September–October: Equipment materials, robotics, satellite internet catalysts land, domestic substitution main line strengthens;
3. November–December: Year-end computing capex, new energy installations data verification, full-year high-growth leader valuation recovery.