Qualcomm plans to bring data center chip technology to smartphones to enhance on-device AI capabilities.

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Jinse Finance reports that on June 27, Qualcomm Executive Vice President Durga Malladi stated that the company plans to apply the data center chip technology newly released this week to smartphones, in order to enhance the local AI computing capabilities of mobile devices. Qualcomm's new high-bandwidth computing (HBC) architecture adopts a vertical chip stacking design, tightly integrating memory and computing units, which can significantly improve data transmission speed and efficiency. The first generation of this architecture will be launched in data centers next year, with commercial supply expected in 2028. Malladi said, "The technology for data centers will not stop there," and the company is currently in discussions with smartphone, PC, and automotive manufacturers regarding the related technology.
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