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TSMC plans to achieve a compound annual growth rate of 70% for N2/A16 advanced process capacity from 2026 to 2028.
Facing the explosive growth of AI, TSMC expects the global semiconductor market to exceed $1 trillion this year and reach $1.5 trillion by 2030.
Demand mainly comes from high-performance computing (HPC) and AI, accounting for 55% of the overall market; followed by smartphone demand at about 20%, and automotive and IoT demand each at about 10%.
TSMC plans that from 2026 to 2028, the compound annual growth rate of N2/A16 advanced process capacity will reach 70%; from 2022 to 2027, the capacity of mature advanced processes N3 and N5 will grow by 25% annually; the wafer output of N2 in its first year will be 45% higher than that of N3 in the same period.
TSMC plans that the compound annual growth rate of CoWoS and SoIC advanced packaging capacity from 2022 to 2027 will exceed 80%.
(Shanghai Securities News)