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Gaocao Co., Ltd.: 12-inch silicon-based semiconductor wafer slicing machines see a surge in orders, having already secured bulk orders from leading customers

MarsBitNews
Mars Finance News: Gaoce Shares stated on the interactive platform that the company's semiconductor products focus on the core processes of semiconductor dicing and grinding. The product matrix has expanded from a single cutting device to include all processes such as chamfering and thinning, achieving an upgrade from single-point equipment to integrated full-line solutions. As demand for large silicon wafers increases, substrate manufacturers' expansion plans are gradually being implemented. The company's 12-inch silicon-based semiconductor slicer has seen a surge in orders, having secured bulk orders from leading clients, accounting for the majority of the market share. (Cailian Press)
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