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I'm here for a mental massage. TSMC's latest 2027 CoWoS capacity allocation has been released.
The global AI XPU industry will achieve approximately 60% year-over-year growth.
By 2027, the total global CoWoS demand is expected to reach 2.69M wafers (compared to an estimated 1.39M wafers in 2026), a 93% increase year-over-year.
HBM demand surges:
In 2026, the global AI HBM consumption is estimated at 31 billion Gb (hundred billion gigabits).
In 2027, it is expected to reach as high as 51 billion Gb.
Among them, NVIDIA's Rubin R200 (1.7M GB) and Rubin Ultra (399k GB), as well as AMD MI400 (829k GB) and Google SunFish (1.14 million GB), are major HBM consumers.
HBM4 and HBM4e will begin large-scale adoption.
Semiconductors will never be slaves; this week is the last opportunity to increase positions.