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SanDisk patent exposes a 3D storage-and-compute architecture: coordinated layered collaboration between HBM and NAND
This design aims to address the capacity limitations of HBM (approximately 32–64GB per stack). Previously, SanDisk proposed the HBF architecture, which stacks NAND vertically using TSVs, achieving capacities of up to 4TB, an 8–16 times increase over HBM, but still facing challenges related to latency and system integration complexity.
Compared to DRAM, NAND offers higher capacity and lower cost but slower access speeds. The new architecture achieves a perfect complement of both through 3D layering. (Titan Garage)