TSMC Fully Drives CoPoS Packaging Materials Toward Mass Production in 2028! TrendForce: Taiwanese Panel Manufacturers Compete for Glass Substrate Opportunities with FOPLP

According to the latest report from research firm TrendForce, demand for AI semiconductors is fueling a major battle in advanced packaging technology. TSMC is actively promoting its CoPoS packaging architecture, with mass production expected in the second half of 2028. Meanwhile, Taiwan’s panel manufacturers and local equipment and materials ecosystem, leveraging the leading advantages of fan-out panel-level packaging (FOPLP), are poised to significantly shorten the learning curve in the "glass core substrate" generation after 2030 and seize huge business opportunities.
(Background recap: TSMC sued for "patent cockroaches"! Two US companies accused of infringement; the Director of the Smart Industry Bureau: TSMC has counterattacked, making the challenge ineffective)
(Additional background: The Information: Google plans to commission Samsung to produce the 10th generation AI chip "Icefish," diversifying supply risks away from TSMC)

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• Glass core substrates face two major technological hurdles
• Taiwanese panel manufacturers have a first-mover advantage, perfectly complementing wafer fabs
• Local materials and equipment ecosystem takes shape

The AI computing power race is driving continuous breakthroughs in advanced packaging technology, with fan-out panel-level packaging (FOPLP) emerging as a new battleground in the semiconductor industry. According to the latest report released by TrendForce on June 17, 2026, TSMC, the leading wafer foundry, is currently focusing on its Chip-on-Panel-on-Substrate (CoPoS) architecture, which has standardized on a 310 × 310 mm panel size.

Regarding CoPoS technology, TSMC has set a clear development timetable: 2026 will be a critical validation year for related equipment and material suppliers, aiming to enter pilot production by 2027, with full mass production expected in the second half of 2028. After CoPoS, TSMC’s next major focus will be the more technically challenging "glass core substrate," with commercialization and mass production estimated to occur after 2030.

Glass core substrates face two major technological hurdles

Although glass substrates offer better flatness than traditional organic substrates, maintaining nanometer-level flatness on large panels exceeding 500 × 500 mm is extremely difficult. TrendForce highlights two major challenges currently facing this technology:

• Through-Glass Via (TGV) fabrication difficulties: including laser energy fluctuations causing inconsistent via sizes, micro-cracks in the glass during drilling, metallization challenges due to insufficient etchant permeability in sub-10 μm vias, and the need for extremely high-precision dynamic alignment in high-volume manufacturing environments.
• Material thermal stress challenges: mismatched coefficients of thermal expansion (CTE) among multilayer heterogeneous materials can easily cause warpage during processing, severely affecting exposure alignment accuracy and final yield.

Taiwanese panel manufacturers have a first-mover advantage, perfectly complementing wafer fabs

Faced with these technological hurdles, Taiwanese panel manufacturers hold a clear first-mover advantage. TrendForce analyzes that several Taiwanese panel makers have already achieved mass production of FOPLP in mature processes (such as PMIC and RF components), with packaging sizes up to 620 × 750 mm. By fully utilizing their existing large-generation display lines, panel makers not only enhance the value of their production lines and create new revenue streams but also leverage decades of experience in handling large glass, precise alignment, and uniform deposition—laying a solid foundation for future TGV and advanced substrate processes. This capability complements and differentiates them from traditional semiconductor wafer fabs and OSAT (outsourced assembly and test) providers.

Local materials and equipment ecosystem takes shape

Meanwhile, Taiwan’s local materials and equipment ecosystem is rapidly catching up and making breakthroughs. On the materials side, specialized chemical suppliers have successfully launched low-temperature curing dielectric materials that can reduce process temperatures below 180°C, effectively decreasing thermal stress accumulation and reducing package warpage risks. On the equipment side, some suppliers have adopted a two-step via formation process combining laser modification with chemical etching, which allows more precise control of via geometries below 10 μm compared to traditional direct laser ablation. This technology has already been validated by major international IDM companies, with shipments gradually increasing.

TrendForce emphasizes in conclusion that Taiwan’s extensive experience in large-scale glass processing, combined with leading semiconductor companies’ advanced packaging and process integration capabilities, has established a unique competitive advantage. With the local materials and equipment ecosystem maturing and TSMC’s ongoing push for localization strategies, Taiwan is well-positioned to significantly shorten the learning curve for glass core substrates and open a new path for the transformation and upgrading of the panel industry.