Deer Laser: The company's TGV laser micro-hole equipment has achieved wafer-level and panel-level device delivery.

Mars Finance News: On June 16, Dier Laser said on an interactive platform that the company’s TGV laser micro-hole equipment is mainly designed for precision through-hole processing of glass substrates. It has already achieved delivery of wafer-level and panel-level equipment, with its overall layout focusing on advanced semiconductor packaging and fields related to new displays. (Cailian Press)
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