The arms race for storage chips has just begun; the capacity gap before 2030 means that the next five years will be a dual battle between domestic substitution and Korean manufacturers expanding production. Those betting on HBM and advanced packaging should wake up and smile.

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MarsBitNews
SK Hynix: Will double storage chip wafer capacity within the next five years
Mars Finance News, on June 2nd, SK Hynix Group Chairman Choi Tae-yoon stated that they plan to double their storage chip wafer capacity within the next five years, and it is expected that the bottleneck issue for storage chip capacity may persist until 2030.
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