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TSMC's CoWoS capacity is ramping up from 35,000 units per month by the end of 2024 to 130,000 units by the end of 2026, boasting an 80% annual compound growth rate. Still fully sold out.
NVIDIA has locked in over 60% of the CoWoS capacity. Chips produced at the Arizona fab are 100% airlifted back to Taiwan for packaging. US chip production and Taiwan packaging—this is what they call "semiconductor localization"?
NVIDIA will release its Q1 earnings report the day after tomorrow, guiding for $78 billion. Jensen Huang is claiming they’ll sell $1 trillion in AI chips over the next two years, 2026-2027. The bottleneck isn't in the transistors; it's in the packaging.#TradfiTradingChallenge