South Korea and Japan Unveil Vertical HBM Architecture Designs to Boost AI Memory Bandwidth by 80%
At the 2026 IEEE/JSAP VLSI conference, research teams from South Korea's UNIST and Japan's University of Tokyo independently announced two new high-bandwidth memory (HBM) architectures—V-Die and MOSAIC—that rotate DRAM chips from a horizontal to vertical orientation to improve thermal dissipation an
GateNews·07-13 05:17




