$SKHY Is Expanding Beyond HBM

SK Hynix is developing Processing-in-Memory (PIM), which processes data inside or near memory to reduce data movement, latency, and power consumption
The company claims PIM can deliver 300× the memory capacity of SRAM in the same chip area and is exploring hybrid bonding to stack compute and memory dies without sacrificing density
Meanwhile, High Bandwidth Flash (HBF) combines 3D NAND density with HBM-style interconnects to deliver higher capacity at lower cost, targeting long-context and large-batch inference
SK Hynix is also developing SALT-KV, software that distributes KV cache across HBM, DRAM, and SSDs to reduce dependence on expensive memory