$MU Micron plans to add 60,000 HBM wafers/month in capacity this year, with total capacity expected to double from current levels

Micron plans to make large-scale equipment investments by the end of the year to expand production of its latest 12-layer HBM4 products, adding up to 60,000 HBM wafers/month in capacity. Total capacity is expected to double, helping it catch up with Samsung and SK hynix in HBM market share.
Micron has suddenly unveiled a major HBM capacity expansion plan, directly targeting the core supporting component currently in shortest supply for AI chips. Many investors who had previously focused only on South Korean manufacturers’ expansion pace may have overlooked the incremental growth potential that Micron’s expansion could bring to the domestic supply chain.
Micron plans to make large-scale equipment investments by the end of the year to increase the supply of its latest-generation HBM—12-layer HBM4 products. The move aims to make up for its HBM capacity shortfall relative to Samsung Electronics and SK hynix, thereby increasing its market share. Micron plans to add up to 60,000 HBM wafers/month in capacity by the end of this year, with total capacity expected to double.$MU