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Winbond: 192-layer 3D NAND is expected to enter mass production in 2027, with an additional investment of NT$15.8 billion

MarsBitNews
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Mars Finance News: Winbond has released its Q2 financial report. The company’s quarterly operating revenue was NT$19.1 billion, up 180% year-on-year. The gross margin reached 64.4%; the operating profit margin was 46.9%. Winbond said that 3D NAND is currently all MLC, with 48-layer and 96-layer capacity already available, and 192-layer production is expected to start mass production next year, while TLC is expected to be introduced at the 300-layer stage with no mass production plan at present. On the same day, Winbond’s board of directors approved a new capital expenditure budget, planning to invest NT$15.81 billion starting from this quarter to gradually fund production equipment, cleanrooms, and back-end facilities. The company expects this to bring additional capacity of 4,000~5,000 extra 12-inch wafer units per month. (Sina Finance)
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