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Israeli chipmaker Tower Semiconductor will invest $3 billion in Japan

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Israeli chipmaker Tower Semiconductor announced on July 14 local time that it will invest $3 billion to strengthen its chip manufacturing in Japan, including a $1 billion grant from the Japanese government. The statement said the first phase will significantly increase production capacity for 300-millimeter silicon photonics devices, with full production expected to begin in Q4 2027. This phase includes retrofitting the existing Fab 6 plant to support 300-millimeter silicon photonics device output and advanced packaging capabilities. The second phase will start in parallel with the first phase, including building a new 300-millimeter lithography tool manufacturing plant next to the Fab 7 plant. (Blue Whale News)
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