Lens Technology: Signed a cooperation memorandum with Intel

Golden Finance reported that on July 24, Lens Technology announced that its wholly owned subsidiary, Lens International (Hong Kong) Co., Ltd., recently signed a memorandum of understanding with Intel Corporation. The memorandum mainly discusses the parties’ intended cooperation and preliminary arrangements in the field of advanced packaging for glass through holes (TGV), including key processes such as glass substrate hole forming, high-precision laser processing, metallized through-hole deposition, and multilayer interconnect wiring. The two sides will discuss and evaluate potential cooperation. Intel will provide relevant architectural information, manufacturability design guidelines, benchmarking methods, and validation methods. The memorandum is valid for one year from the date it is signed by the authorized representatives of both parties, and may be extended by mutual agreement before it expires. (Jin10)
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