AMD and Samsung are close to completing large-scale HBM4 supply contracts, with Helios expecting shipments by the end of Q3.

Mars Finance reports that on July 24, according to The Seoul Economic Daily, AMD CEO Lisa Su said that the talks between the company and Samsung Electronics regarding signing a formal contract for large-scale HBM4 supply are “near completion.” In March this year, the two sides had already signed a memorandum of understanding covering, among other things, that Samsung will prioritize supplying HBM4 to AMD’s next-generation AI accelerator, and will advance their foundry outsourcing cooperation.

At the “AMD Advancing AI 2026” event, Su said that AMD’s AI server rack system Helios has entered full-scale mass production, and it is expected to begin shipments starting from the end of the third quarter. With Helios moving into production, AMD is discussing with Samsung the specific contracts to further expand HBM4 supply.

Han Jin-man, head of Samsung’s foundry business, and Cho Sang-yeon, head of Samsung’s semiconductor business in the Americas, attended the event. After the speeches, they continued discussions with AMD executives including CTO Joseph Macri. The two Samsung executives said that an important meeting will be held soon, but did not specifically respond to the issue of the follow-on HBM4 contracts. When Macri was asked about the future HBM supply and the possibility that AMD chips would be manufactured by Samsung, he only said that the two sides remain in a “cooperative relationship.”