NAND Manufacturers Transitioning From Tungsten to Molybdenum as Stacks Exceed 300 Layers; Mo to Reach 30% of Capacity by 2027
According to SemiAnalysis on August 23, 3D NAND memory production is shifting from tungsten (W) to molybdenum (Mo) as stack heights surpass 300 layers, driven by physical and manufacturing constraints of traditional tungsten word lines. SK Hynix currently leads
GateNews·08-23 11:22
