TSMC Expands CoW Process Outsourcing to ASE and OSAT Partners Amid AI Chip Capacity Crunch
TSMC is expanding outsourcing of its Chip-on-Wafer (CoW) process to OSAT partners including ASE, Amkor, and SPIL, marking a shift in its advanced packaging supply chain structure. The move addresses capacity bottlenecks as TSMC holds an estimated 90% share of global AI chip manufacturing, facing ove
LucasBennett·08-11 08:07
