Micron 2026 Technology Symposium: vHBM and vEIM to Launch in 2028, Targeting 2 TB/s of Bandwidth
According to IT Home on Oct. 22, Micron held its 2026 Technology Symposium last week and expects to launch two new types of 3DS memory in 2028, when standard HBM5 is also expected to arrive: vHBM (3D-integrated HBM) and vEIM (edge AI inference memory). vHBM uses numerous DRAM chips, a base die, and an XPU logic die. Micron 2026 Technology Symposium: Two New Types of 3DS Memory to Launch Alongside HBM5 At its 2026 Technology Symposium, Micron shared its outlook on DRAM, HBM and related technologi
Bisc·10-22 02:35
