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Samsung Reportedly to Allocate More Than Half of Its 4nm Capacity to HBM4 Base Die Production

Mars Finance News, September 8: Samsung Electronics plans to allocate more than half of its 4nm capacity to producing base dies for HBM4, according to reports. An informed source said that Samsung Electronics’ 4nm process is currently in full-scale production, with HBM4 base dies accounting for 50% to 60% of total output. This high proportion will be maintained in the second half of this year. (Wide-Angle Observation)
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LiquityGuard
16 minutes ago
Is Samsung going all-in on HBM4? It’s cutting 4nm capacity in half for base dies, and the memory market could be turned upside down in the second half of the year.
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ASkinnyGuyWhoDoesn'tUnderstand
an hour ago
Why not ride the wind and soar straight up 90,000 miles!
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ASkinnyGuyWhoDoesn'tUnderstand
an hour ago
Full send 👊
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ASkinnyGuyWhoDoesn'tUnderstand
an hour ago
Just send it 👊
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GasStationAttendant
2 hours ago
First Review
Traditional DRAM and logic chip capacity is giving way to HBM4. Samsung’s strategic shift is decisive; now it remains to be seen whether yields can hold up.
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