TSMC CoWoS Capacity Shortage Drives $1.3B HBM Orders to Intel Malaysia Plant
According to Economic Daily, TSMC's advanced CoWoS packaging capacity has become supply-constrained, with overflowed orders now supported by Intel's Malaysia facility for backend packaging to serve mutual customers. SemiAnalysis Chipbook data shows approximately $1.3 billion in HBM has been
GateNews·08-19 02:02

