STMicroelectronics enters high volume production of photonics chip

STMicroelectronics has begun high-volume production of its PIC100 data center photonics chip, designed to support 800Gbps and 1.6Tbps optical interconnects for AI workloads. The company also introduced the PIC100 TSV platform, which integrates through-silicon vias to support future near-packaged and co-packaged optics, aligning with hyperscalers’ long-term goals for optical-electronic integration. STMicroelectronics plans to quadruple production by 2027, backed by customer commitments, to meet the demand driven by the AI infrastructure super-cycle.