建滔积层板01888.HK Price

Kingboard Laminates Group established its first copper-clad laminate plant in Shenzhen, China in 1988 and began producing paper copper-clad laminates in 1989. Subsequently, the Group expanded rapidly both horizontally and vertically. Horizontally, the Group extended its production to new types of copper-clad laminates, including epoxy glass fiber copper-clad laminates and flame-retardant paper copper-clad laminates. Vertically, the Group developed the production of key upstream raw materials, including copper foil, glass yarn, glass fiber cloth, bleached wood pulp paper, and epoxy resin. In 1999, the copper foil business located in Fogang, China was spun off and listed on the Singapore Exchange under the name Kingboard Copper Foil. In December 2006, the Group was successfully listed on the Main Board of the Hong Kong Stock Exchange. These developments have enabled the Group to optimize economies of scale and achieve cost efficiency through its vertically integrated production structure, thereby gaining strong competitiveness. The Company currently operates over 20 plants in Southern and Eastern China, with a strategy to further expand its business in China to meet the growing demand for copper-clad laminates and related products driven by the growth of the global electronics market. The Group is a leading vertically integrated manufacturer of electronic materials, focusing on the production of copper-clad laminates, including epoxy glass fiber copper-clad laminates, paper copper-clad laminates, and CEM copper-clad laminates. According to the latest research report from Prismark Partners LLC, the Group achieved a global market share of 14.3% in copper-clad laminates in 2010, holding the top position in the industry for six consecutive years.