IBM and Lam Research Corp. have announced a five-year collaboration to develop processes and materials for sub-1nm logic scaling, building on over a decade of previous partnerships. This agreement focuses on advancing IBM’s logic scaling roadmap through joint development in novel materials, fabrication processes, and High NA EUV lithography. The work, conducted at IBM’s Albany NanoTech Complex, aims to enable continued scaling for future logic devices.
IBM, Lam Research partner on sub-1nm chip development
IBM and Lam Research Corp. have announced a five-year collaboration to develop processes and materials for sub-1nm logic scaling, building on over a decade of previous partnerships. This agreement focuses on advancing IBM’s logic scaling roadmap through joint development in novel materials, fabrication processes, and High NA EUV lithography. The work, conducted at IBM’s Albany NanoTech Complex, aims to enable continued scaling for future logic devices.