Hua Hai Qing Ke: Mesin CMP ke-1000 Dikeluarkan

People’s Financial News 8 April, Huahai Qingke (688120) announced on April 8 that recently, the company’s 1000th CMP equipment was officially shipped and sent to a leading domestic integrated circuit enterprise. The company’s CMP equipment has completed relevant testing before leaving the factory, but after the equipment arrives at the customer’s site, installation, debugging, and process verification work still need to be carried out. Currently, rapid development in fields such as artificial intelligence and high-performance computing has strongly driven the continuous increase in demand for advanced processes, advanced packaging, and chip stacking. As a core process for achieving nanometer-level surface flatness control, CMP’s application scenarios and process requirements in advanced logic, advanced memory, and advanced packaging are continuously expanding. At present, the company’s main CMP models and new generation products can fully adapt to mainstream application scenarios such as integrated circuits, power semiconductors, 3D integration and advanced packaging, compound semiconductors, new displays, and substrate materials, and have entered large-scale production lines of domestic advanced processes.