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TSMC CoPoS Pilot Line Demo Equipment Suppliers
Lithography and Coating: Canon's FPA-5525iV LF2 lithography tool; Germany's SUSS DSC310s Gen4 exposure system and ACS310 Gen2 coating/developing platform; Japan's TEL LITHIUS Pro SQ3; SCREEN's LM-3000; and Scientech's panel level release layer coating equipment.
Metallization and Copper Plating: Applied Materials (應材), KLA-Tencor (科磊), and 力鼎精密. Copper plating is handled by Lam Research's SABRE 3D FP, while UBM etching includes Lam Research's Quaros FP.
Grinding and Laser Processing: Japan's DISCO has secured nearly all of the related equipment orders; Nitto provides Frame Mount and UV Erasing equipment; LINTEC handles Lamination and De-taping processes. KNS (K&S) APTURA WP and ASMPT Firebird XQ have each entered the Fluidless Die Attach segment; Japan's Shibaura supplies the TFC-6600-WB and TFC-6500-WB systems; and Taiwanese maker 萬潤 (All Ring) has entered the underfill equipment segment.
Wet Process Equipment: 弘塑 (Grand Process Technology) and 辛耘 (Scientech) are the key Taiwanese beneficiaries in the CoPoS supply chain. 印能's BPO-60A, KE's 450A and 450A-HT, and 志聖 (C SUN)'s HOMOL-AP31, HP-AP31, and CSL-A300PL have entered the baking and thermal processing segment.
Molding and Encapsulation: Japan's TOWA and YAMADA.
Reflow Equipment: handled by SEMIGEAR and Heller.
Metrology and Inspection: 倍利科's V5P310 Pro Glass glass AXI inspection tool and V5300 Macro AOI system; 晶彩科技 handles Overlay metrology; 威克半導體 has entered 3D profile and dimensional metrology; and 大量 (Utechzone) has partnered with Japan's KOBELCO to enter Bevel Inspection and Bonding Shift metrology equipment. Other listed Taiwanese makers include 致茂 (Chroma ATE), 家登 (Gudeng Precision), 均華, 大量, 亞亞, 佳宸, and 禾鏵.