CITIC Construction Investment : La dissipation thermique par diamant continue d'itérer, les dissipateurs thermiques en diamant, les matériaux composites en cuivre diamant sont les plus rapides à être commercialisés.

robot
Création du résumé en cours
Mars Finance news, CITIC Construction Investment research report believes that the continuous expansion of the computing power industry has driven a significant increase in chip integration and power density, and under high heat flux density, traditional copper-based cooling materials have reached a bottleneck.
Diamond thermal conductivity far exceeds that of copper, silver, silicon, silicon carbide, and other materials, making it a key direction to break through the bottleneck of high-end chip cooling.
Currently, diamond cooling materials include three main routes: diamond-based composites, single-crystal diamond, and polycrystalline diamond, with the technical routes not yet fully finalized.
Among them, diamond-copper composites balance performance and cost, leading the industrialization pace.
Applications include diamond substrates, diamond heat sink plates, and diamond microchannel cooling forms.
Diamond heat sink plates and diamond-copper composites are the fastest to commercialize, with relevant products already available from domestic and international manufacturers.
Diamond is extending from traditional abrasives and cultivated diamonds to functional materials such as semiconductor and high-power device heat conduction.
The growth of AI computing power continues to open up space for ultra-high thermal conductivity diamond materials, with a focus on mass production and customer certification progress.
Voir l'original
Cette page peut inclure du contenu de tiers fourni à des fins d'information uniquement. Gate ne garantit ni l'exactitude ni la validité de ces contenus, n’endosse pas les opinions exprimées, et ne fournit aucun conseil financier ou professionnel à travers ces informations. Voir la section Avertissement pour plus de détails.
  • Récompense
  • Commentaire
  • Reposter
  • Partager
Commentaire
Ajouter un commentaire
Ajouter un commentaire
Aucun commentaire
  • Épinglé