Médias coréens : ASML développe un équipement de collage hybride wafer-à-wafer, susceptible de réduire considérablement le cycle de production

Gold Finance reports that on April 29th, according to Korean media The Elec, Professor Joo Seung-hwan from Inha University in South Korea revealed at the Advanced Packaging Technology Conference in Seoul that, through patent analysis, Dutch lithography giant ASML may be leveraging its flagship lithography platform Twinscan’s technological accumulation to develop wafer-to-wafer ( hybrid bonding equipment. The Twinscan platform, with its dual wafer stage design, significantly improves manufacturing efficiency; if this technology is transferred to W2W hybrid bonding equipment, it could substantially shorten the production cycle of direct wafer bonding. This latest development indicates that ASML is attempting to extend its dominance in lithography to the packaging sector. ) Dongxin News (