Due Secures $7.3 Million in Seed Funding Set for July 30, 2025

According to industry sources, Due has completed a $7.3 million Seed funding round scheduled for July 30, 2025. The round was jointly led by Speedinvest, Fabric Ventures, Semantic Ventures, Polymorphic Capital, and Strobe Ventures. Following this transaction, Due's total funding to date reaches $10.6 million.Due is a decentralized payment platform focused on providing users with borderless business account services. The platform enables users to send and receive payments globally and offers instant access to funds in either stablecoins or local currencies. Due’s innovative solutions effectively address inefficiencies and high costs associated with traditional cross-border payments.Notably, Due previously raised $3.3 million in a Seed round in November 2023. Securing successive rounds within less than two years underscores sustained investor confidence in the decentralized payments sector. As global demand for digital payments continues to grow, Due’s borderless payment solution is poised to play a significant role in advancing global business connectivity. This latest funding will further support Due in optimizing its product features, expanding market share, and delivering more convenient and secure payment services to users worldwide.