$50,80
-$4,05(-7,38%)
*Data last updated: 2026-08-20 08:51 (UTC+8)
As of 2026-08-20 08:51, Amkor Technology, Inc. (AMKR) is priced at $50,80, with a total market cap of $16,10B, a P/E ratio of 26,14, and a dividend yield of 0,51%. Today, the stock price fluctuated between $50,67 and $55,09. The current price is 0,25% above the day's low and 7,78% below the day's high, with a trading volume of 9,24M. Over the past 52 weeks, AMKR has traded between $42,11 to $81,99, and the current price is -38,04% away from the 52-week high.
Key Stats
Yesterday's Close$65,33
Market Cap$16,10B
Volume9,24M
P/E Ratio26,14
Dividend Yield (TTM)0,51%
Dividend Amount$0,08
Diluted EPS (TTM)1,76
Net Income (FY)$373,89M
Revenue (FY)$6,70B
Earnings Date2026-07-27
EPS Estimate0,47
Revenue Estimate$1,81B
Shares Outstanding246,46M
Beta (1Y)2.214
Ex-Dividend Date2026-06-03
Dividend Payment Date2026-06-23
Introduction
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
SectorTechnology
IndustrySemiconductors
CEOKevin K. Engel
HeadquartersTempe,AZ,US
Official Websitehttps://amkor.com
Employees (FY)30,80K
Average Revenue (1Y)$217,79K
Net Income per Employee$12,13K
AMKR FAQ
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Amkor Technology, Inc. (AMKR) is currently trading at $50,80, with a 24h change of -7,38%. The 52-week trading range is $42,11–$81,99.
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