Shenzhen: Accelerate Research and Development of Advanced Packaging Technology for Storage Chips, Focus on Developing High-End Storage Products such as Enterprise-Grade SSDs and Enterprise-Grade Memory Modules

2026-03-25 06:32:18

People’s Financial News, March 25 — The Shenzhen Municipal Bureau of Industry and Information Technology recently issued the “Action Plan for Accelerating the High-Quality Development of the Artificial Intelligence Server Industry Chain in Shenzhen (2026–2028).” The plan proposes supporting the research and development and application of storage chips, accelerating breakthroughs in advanced packaging technology for storage chips, and focusing on developing high-end storage products such as enterprise SSDs and enterprise memory modules. It also emphasizes strengthening research and development of new technologies like near-memory packaging and integrated storage and computing, enhancing the supply capacity of high-end storage, and building a supply system of high-end storage products suitable for large model training and supercomputing centers.

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