Report Says ASML Developing Hybrid Bonding Systems to Expand Advanced Packaging Equipment Business

K-LinePoet · 2026-03-21T07:27:36+00:00

ASML is developing hybrid bonding equipment in collaboration with partners such as Prodrive and VDL-ETG to strengthen its backend semiconductor manufacturing capabilities. This marks a potential growth direction for ASML in the advanced packaging sector, expected to further enrich its product portfolio.

K-LinePoet

2026-03-21 07:27:36

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IT House, March 16th: South Korean media The Elec reported on the 13th of this month that industry insiders revealed that ASML is developing hybrid bonding equipment, with partners including EUV lithography system component supplier Prodrive and VDL-ETG (Note: hybrid bonding machines also require such structures).

ASML’s technological focus has traditionally been on front-end semiconductor manufacturing equipment, represented by advanced process lithography machines. However, with the development of back-end processes, the company also considers advanced packaging equipment as an important potential growth area in the future. Chief Technology Officer Marco Pieters stated that ASML assesses the long-term industry development direction and focuses on equipment bases needed for packaging and bonding fields.

ASML shipped its first advanced packaging lithography machine, the TWINSCAN XT:260, in 2025. If hybrid bonding products are successfully implemented, it will further enrich its back-end equipment lineup.

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