QuickLogic Announces Contract for High Density eFPGA Hard IP Optimized for Intel 18A

NodeGuardian · 2026-03-18T00:02:51+00:00

QuickLogic Corporation has obtained a mid-6-figure contract to improve its eFPGA Hard IP using Intel 18A technology, aiming to reduce power consumption, enhance performance, and minimize silicon area. This initiative will expand their market reach for high-density eFPGA cores in ASICs and SoCs.

NodeGuardian

2026-03-18 00:02:51

Abstract generation in progress

QuickLogic Corporation has secured a mid-6-figure contract to implement architectural enhancements for its eFPGA Hard IP in a new customer ASIC, utilizing Intel 18A technology. These advancements are designed to reduce power consumption, increase performance, and decrease silicon area for high-density eFPGA cores, making them suitable for advanced fabrication nodes and broadening QuickLogic’s market reach for cost-sensitive applications. The company believes this significantly enhances its ability to address requirements for very high-density eFPGA cores in ASICs and SoCs, as well as large discrete FPGA needs.

This page may contain third-party content, which is provided for information purposes only (not representations/warranties) and should not be considered as an endorsement of its views by Gate, nor as financial or professional advice. See Disclaimer for details.