Shengyi Electronics: Plans to issue shares to raise a total amount of no more than RMB 2.53 billion for projects including the construction of an artificial intelligence computing HDI manufacturing base.

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Shengyi Electronics Announcement: The company held the 36th meeting of the third board of directors on March 12, 2026, to review and approve proposals including the “Adjustment of the 2025 A-share issuance plan to specific targets.” The total amount of funds to be raised through this issuance has been adjusted, as well as the amount of funds allocated for certain investment projects. After the adjustment, the total amount of funds to be raised from the issuance to specific targets will not exceed RMB 2.53 billion (including this amount). The net proceeds after deducting issuance costs are planned to be invested in the following projects: Artificial Intelligence Computing HDI Production Base Construction Project (planned investment of RMB 1 billion), Intelligent Manufacturing High-Performance Multi-Layer Computing Circuit Board Project (planned investment of RMB 1.1 billion), and to supplement working capital and repay bank loans (planned investment of RMB 429.5 million).

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