Moore's Law's Second Half: AI-Driven Restructuring of Advanced Packaging

2026-02-08 03:42:45

By 2026, the focus of the semiconductor industry is shifting dramatically from solely process miniaturization to system-level performance breakthroughs centered around “advanced packaging.” The significant increase in TSMC’s capital expenditures and their clear emphasis on advanced packaging mark a milestone, combined with the insatiable demand for AI computing power. A wave of industry value reshaping and capital expenditure driven by advanced packaging has already fully begun.

What major impacts will this have on the entire industry?

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