Hainan: Accelerate the development of a collaborative electronic information manufacturing industry ecosystem driven by chip design, breakthroughs in advanced packaging and testing, and extended maintenance manufacturing

Mars Finance News, June 9 — The General Office of the Hainan Provincial People’s Government issued the “Hainan Province 15th Five-Year Plan for High-Tech Industry Development.” It states that efforts will be made to accelerate the building of a coordinated electronic information manufacturing industry ecosystem characterized by “chip design driving, breakthroughs in advanced packaging and testing, and extended maintenance and manufacturing.”

In the upstream segment, integrated circuit design will be consolidated. Chip design enterprises in areas such as high-end displays, intelligent sensing, and intelligent computing will be introduced. Packaging and testing capacity in the locality will be connected. A plan will be developed to build a public service platform for integrated circuit design, and basic service capabilities will be enhanced, including EDA tools, IP design, and AI-assisted design.

In the midstream segment, advanced packaging and testing will be strengthened. The manufacturing capacity for semiconductor devices and power module production will be expanded. High value-added products such as intelligent power modules and high-end sensors will be developed. Enterprises are supported to actively apply advanced packaging technologies including 2.5D/3D, wafer-level, and system-level packaging. Packaging and testing equipment manufacturing companies and third-party testing institutions will be introduced to improve localized capabilities in packaging, testing, and verification—so as to connect upstream chip design with downstream terminal manufacturing.

Driven by market demand, efforts will be made to actively lay out third-generation semiconductors, deepen research and applications of semiconductor materials such as silicon carbide, gallium nitride, and indium phosphide, and plan to open up new packaging and testing tracks in areas such as high-speed storage, optical communications, and AI computing.

In the downstream segment, product repair and manufacturing will be expanded. Production lines for high-performance servers, innovative information technology complete systems, display terminals, and digital energy will be supported to reach production capacity and expand production scale. Enterprises will be supported to carry out intelligent and flexible upgrade and transformation projects, and localized capacity coordination will be gradually formed.

Taking advantage of the open-policy benefits of the Hainan Free Trade Port, the province will expand repair, testing, and remanufacturing industrial formats for products such as semiconductor equipment, storage products, and mobile terminals to international markets. (Website of the Hainan Provincial People’s Government)